OPTOELECTRONIC SEMICONDUCTOR CHIP

摘要

Disclosed is an optoelectronic semiconductor chip (1) comprising a radiation-permeable surface (3), a metallic contact coating (2a) that is applied to the radiation-permeable surface (3), and a first series of reflecting layers (2b) which is applied to the surface of the metallic contact coating (2a) facing away from the radiation-permeable surface (3). Also disclosed is an optoelectronic component comprising such a chip.