| 摘要 |
The stacked package is provided to minimize the malfunction due to the signal delay or the noise by forming a stack package of the structure which adheres the substrates with the medium of bump. The stacked package comprises the first substrate(220), the first semiconductor chip(210), the second substrate(240), and the second semiconductor chip(230). The first semiconductor chip is flip-chip-bonded on the first substrate. The second substrate is arranged on the first semiconductor chip. The second substrate is electrically connected to the first substrate. The second semiconductor chip is flip-chip-bonded on the second substrate. |
