发明名称 |
INJECTION MOLDING SYSTEM, COMPUTER PROGRAM, METHOD OF INJECTION MOLDING, AND INJECTION MOLDING MACHINE |
摘要 |
<p>An injection molding system which enables the temperature of a mold to be precisely regulated even when there is a delay in increasing the mold temperature upon heat supply with a heating medium; a computer program; a method of injection molding; and an injection molding machine. During each injection molding cycle, after initiation of resin injection, the temperatures of a stationary mold half and a movable mold half are regulated so as to be kept between the upper limit (TU) and lower limit (TL) of a predetermined temperature region. This temperature control of the stationary mold half and movable mold half is conducted only by turning onor off a heating medium, without conducting cooling with a cooling medium or the like. In the course of resin cooling, the temperatures of the stationary mold half and movable mold half are regulated by supplying a cooling medium, stopping the supply, supplying the heating medium, and stopping the supply so that the temperatures thereof are kept between the upper limit (TUa) and lower limit (TLa) of a temperature region effective in annealing the resin.</p> |
申请公布号 |
WO2009001485(A1) |
申请公布日期 |
2008.12.31 |
申请号 |
WO2007JP71214 |
申请日期 |
2007.10.31 |
申请人 |
MITSUBISHI HEAVY INDUSTRIES PLASTIC TECHNOLOGY CO., LTD.;SHIKASE, YOSHIO;HATTORI, MICHITAKA;NOZAKI, SHIGERU;IMAEDA, SATOSHI;KARIYA, TOSHIHIKO |
发明人 |
SHIKASE, YOSHIO;HATTORI, MICHITAKA;NOZAKI, SHIGERU;IMAEDA, SATOSHI;KARIYA, TOSHIHIKO |
分类号 |
B29C45/73;B29C45/78 |
主分类号 |
B29C45/73 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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