| 摘要 |
The fuse of the semiconductor device is provided to minimize the dispersion of the laser beam energy in the blowing monitoring process and to reduce the inferiority rate of the semiconductor device and to improve the yield of device. The fuse of the semiconductor device comprises the cutting region(210), and the blowing region. The cutting region comprises a plurality of fuse lines(204). The fuse line is removed by blowing. The blowing region has line regions(212, 214) arranged in the both sides. The cutting region is connected with the line regions of the both sides. The dispersion of the laser beam energy in the blowing monitoring process can be minimized.
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