CONDITIONER FOR CHEMICAL MECHANICAL PLANARIZATION PAD

摘要

A method for manufacturing a conditioner for a chemical mechanical planarization pad and the conditioner for the chemical mechanical planarization pad are provided to increase the lifetime of a tool by reducing the breakdown or the separation of an abrasive particle. A metallic board(21) is positioned inside a plating bath. A plurality of penetration holes with a larger diameter than the diameter of an abrasive particle(23) are formed in a non-conductive frame. The non-conductive frame with the thickness of 50 to 100% of the abrasive particle is positioned in the metallic board. The abrasive particle is attached to the metallic board by performing a first plating process for 0.3 to 4 hours after positioning the abrasive particle in the penetration hole. A heavy build up process for 0.5 to 6 hours is performed after removing the non-conductive frame after the first plating process.