| 摘要 |
A method for implementing an aperture of a multi layer printed circuit board using laser cutting is presented to implement the aperture without influencing on circuits on an inner layer of a bottom substrate of the multi layer printed circuit board. According to a method for implementing a multi layer printed circuit board using laser cutting, a multi layer printed circuit board(300) is generated by heating and pressing a prepreg(110) and a bottom substrate(130)(S1). The prepreg is processed with a bonding agent(120) on a two layer soft copper laminate(100), and has an aperture(210) on a part requiring an air gap part(200). A circuit is formed on the surface of the multi layer printed circuit board(S2). The aperture is formed by cutting the air gap part of the two layer soft copper laminate using a laser(S3).
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