MOLD COMPOUND CIRCUIT STRUCTURE FOR ENHANCED ELECTRICAL AND THERMAL PERFORMANCE
摘要
According to an exemplary embodiment, an overmolded semiconductor package includes at least one semiconductor die situated over a package substrate. The overmolded semiconductor package further includes a mold compound overlying the at least one semiconductor die and the package substrate and having a top surface. The overmolded semiconductor package further includes a first patterned conductive layer situated on the top surface of the mold compound. The overmolded semiconductor package can further include at least one conductive interconnect situated in the mold compound, where the at least one conductive interconnect is electrically connected to the first patterned conductive layer. The first patterned conductive layer can include at least one passive component.
申请公布号
WO2009002381(A2)
申请公布日期
2008.12.31
申请号
WO2008US06063
申请日期
2008.05.12
申请人
SKYWORKS SOLUTIONS, INC.;KUHLMAN, MARK, A.;AGARWAL, ANIL, K.