A RESISTIVE EVAPORATOR FOR USE IN THE VACUUM DEPOSITION PROCESSES

摘要

The invention relates to devices for vacuum evaporation of metals and alloys. It may be used, for example, for depositing comparatively thick coatings onto roll substrates and disperse materials in lengthy processes, as well as for producing free metal foils. The evaporator includes a thin-wall pipe (1) with a porous core (2) symmetrically installed inside the pipe. Thereby a semiclosed space between pipe (1) and porous core (2) is formed. Zone (3) of the said space is an evaporation chamber, which is located in the middle part of the evaporator. A vapour output aperture (5) is made in the pipe opposite the evaporation chamber. The vapour flows through the said aperture (5) and the coating is deposited onto a substrate. In accordance with this invention additional partitions (4) and fluctuation damping chamber (3') and (3") are formed at both sides of the evaporation chambers. In the said fluctuation damping chambers pipe (1) has no apertures for vapour output in the substrate direction. Molybdenum contacts (6) fit in both ends of the pipe and porous core in order to provide reliable electrical and mechanical contact.