Method of fabricating a polycrystalline silicon layer

摘要

A method of fabricating a polycrystalline silicon layer comprises: providing a polycrystalline silicon layer (220) formed by a crystallization method using a crystallization-inducing metal, the polycrystalline silicon layer (220) having a first predetermined region corresponding to a channel region in a TFT and a second predetermined region (220a); providing a metal layer pattern or metal silicide layer pattern (230) in contact with the polycrystalline silicon layer (220) in the second predetermined region (220a) of the polycrystalline silicon layer (220); and performing annealing to getter the crystallization-inducing metal existing in the first predetermined region to the second predetermined region (220a). Accordingly, the crystallization-inducing metal existing in the channel region of the polycrystalline silicon layer can be effectively removed, and thus a thin film transistor having an improved leakage current characteristic and an OLED display device including the same can be fabricated.