发明名称 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOUNTING STRUCTURE THEREOF
摘要 Provided is a multilayer ceramic electronic component wherein deterioration due to migration of a metal contained in a conductive adhesive is not easily generated even the conductive adhesive is used for mounting. A multilayer ceramic electronic component (1) is provided with a ceramic element (2). In the ceramic element, a first internal electrode (3) has a first region (3a), which is extracted to a first end surface (2e) and has a relatively large dimension in the width direction, and a second region (3b), which is positioned on the leading end side of the first region (3a) and has a relatively small dimension in the width direction. When a distance between a first point (P1), which is closest to a first side surface (2c) of the first region (3a) and closest to the second end surface (2f), and a second end surface (2f) is expressed by d1, a distance between first and second round sections (5b, 6b) is expressed by g, and a distance between the leading end of the second round section (6b) and the second end surface (2f) is expressed as c1 when the first side surface (2c) is permitted to be a mounting surface, an inequality of d1>c1+ng1 (n is a constant determined by the size of the multilayer ceramic electronic component) is satisfied.
申请公布号 WO2009001842(A1) 申请公布日期 2008.12.31
申请号 WO2008JP61518 申请日期 2008.06.25
申请人 MURATA MANUFACTURING CO., LTD.;KOGA, SEIJI;SANADA, YUKIO 发明人 KOGA, SEIJI;SANADA, YUKIO
分类号 H01G4/12;H01G4/252;H01G4/30;H05K3/32 主分类号 H01G4/12
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