METHOD FOR ACHIEVING VERY HIGH BANDWIDTH BETWEEN THE LEVELS OF A CACHE HIERARCHY IN 3-DIMENSIONAL STRUCTURES, AND A 3-DIMENSIONAL STRUCTURE RESULTING THEREFROM

摘要

A computer chip is structured to have at least one single-layered chip, at least one multi- layered chip stack, and a carrier package characterized by electrical interconnections of less than 100 microns diameter, wherein the single-layered chip and the multi-layered chip stack are each electrically coupled to the electrical interconnections of the carrier package, and the single- layered chip is communicatively coupled to the multi-layered chip stack through the carrier package so that an electrical signal propagates over a given distance between the single-layered chip and the multi-layered chip stack at substantially a speed of propagation for a single layer chip over the given distance. The single-layered chip can be a processor having multi-cores and the multi-layered chip stack can be a memory cache stack. Interconnect vias, having a density at least as great as 2500 interconnects/cm2 electrically couple the single-layered chip and the multi- layered chip stack to the carrier package.