STACK SEMICONDUCTOR PACKAGE

摘要

The stacked semiconductor packages is provided to laminate many number of semiconductor chips in the stacked semiconductor packages inside instead of making the stacked semiconductor packages thin and to improve the capacity of the stacked semiconductor packages. The stacked semiconductor packages comprises the mounting substrate(110), the odd-number laminated semiconductor chip, the even numbered turn laminated semiconductor chip(120), adhesive members(130, 136, 137), the conductive wire(140), and the encapsulant(150). The mounting substrate has electrode terminals(112) arranged in the upper side. The mounting substrate has connection pads electrically connected to electrode terminals on the lower surface. The odd-number laminated semiconductor chip is laminated on the mounting substrate. The even-numbered laminated semiconductor chip is laminated between odd-number semiconductor chips. The adhesive member is arranged between the odd-number laminated semiconductor chip and even numbered laminated semiconductor chips. The odd number and even numbered laminated semiconductor chip are adhered with the adhesive member. The conductive wire connects first bonding pads of the odd-number laminated semiconductor chip and the second bonding pad of the even numbered laminated semiconductor chip to the electrode terminal. The encapsulant protects the upper side of is mounting substrate including is the odd-number laminated semiconductor chip, and the even numbered laminated semiconductor chip and conductive wire.