首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
Improvements in or relating to methods of treating bodies of semiconductor material
摘要
申请公布号
GB989025(A)
申请公布日期
1965.04.14
申请号
GB19620025259
申请日期
1962.07.02
申请人
PHILIPS ELECTRONIC AND ASSOCIATED INDUSTRIES LIMITED
发明人
分类号
C23F1/00;C23F1/24
主分类号
C23F1/00
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Power line communications system
A c4 substrate contact pad which has a layer of ni-b plating
Intranet graphical user interface for sonet network management
Ozone-induced gene expression in plants
Pcs with enhanced short-message service option
A power-ground plane for a c4 flip-chip substrate
Methods of treatment of wasting syndrome based on administration of derivatives of human chorionic gonadotropin
Antibodies directed against cellular coreceptors for human immunodeficiency virus and methods of using the same
Vacuum assisted web drive for corrugator double backer
Recombinant ribosomal inhibitor protein (rip) and use as immunoconjugate
Sealed Interconnection Device
Process for the preparation of esters of thermically unstable acids
MEDICAMENT WITH ANGIOTENSIN CONVERTING ENZYME (ACE) INHIBITORS SUITABLE FOR TRANSDERMAL APPLICATION
COMPOSITIONS BASED ON APG AND AT LEAST ONE ADDITIONAL NONIONIC SUGAR COSURFACTANT
A cellular telephone holder
Termite barrier for buildings
Carbamoyl carboxylic acid hydrazides and their use against fungi
Composition and process for treating the surface of aluminiferous metals
Mid-stream fluid sampler
Methods for treating motor deficits