发明名称 |
ANISOTROPIC ELCTROCONDUCTIVE MATERIAL, CONNECTION STRUCTURE, AND PROCESS FOR PRODUCING THE CONNECTION STRUCTURE |
摘要 |
This invention provides an anisotropic electroconductive material which, when an IC chip or flexible wiring is connected to a wiring board through an anisotropic elctroconductive material, does not cause a difference in continuity resistance between individual bumps and between linear terminals. The anisotropic electroconductive material comprises electroconductive particles dispersed in an insulating binder, has a lowest melt viscosity [?0] of 1.0 × 102 to 1.0 × 106 mPa sec, and satisfies formula (1). 1 1]/[?0] = 3 (1) wherein [?0] represents thelowest melt viscosity of the anisotropic electroconductive material; [?1] represents the melt viscosity at a temperature T1 which is 30°C below a temperature T0 at which the melt viscosity is the lowest value. |
申请公布号 |
WO2009001605(A1) |
申请公布日期 |
2008.12.31 |
申请号 |
WO2008JP57317 |
申请日期 |
2008.04.15 |
申请人 |
SONY CHEMICAL & INFORMATION DEVICE CORPORATION;TANAKA, YOSHITO;YAMAMOTO, JUN |
发明人 |
TANAKA, YOSHITO;YAMAMOTO, JUN |
分类号 |
H01B1/22;C09J9/02;C09J11/00;C09J201/00;H01B5/16;H01L21/60;H01R11/01;H01R43/00;H05K3/32 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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