| 摘要 |
A method and an apparatus for inspecting a semiconductor device using vision are provided to improve accuracy of the vision inspection by inspecting the semiconductor device through a visible ray and infrared rays twice. A vision inspecting method inspects the semiconductor device composed of a printed circuit board in which a semiconductor chip is electrically connected. After searching for a reference image corresponding to a semiconductor device to be inspected, the searched reference image is loaded(s100). The semiconductor device to be checked is loaded in a check field (s110). The light is applied to the semiconductor device to be checked through a visible ray by using an LED(Light Emitting Diode) as a visible ray lighting device(s120). The object image is obtained by photographing the semiconductor device to be checked by a photographing device of the vision inspecting apparatus mounted in an inspection region if the visible ray illumination is applied(s130). The outer appearance of the semiconductor device to be checked is inspected by comparing the photographed object image with the visible ray reference image(s140).
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