发明名称 |
COMPRESSION MOLDING OF AN ELECTRONIC DEVICE |
摘要 |
<p>COMPRESSION MOLDING OF AN ELECTRONIC DEVICE A compression molding system comprising first and second mold halves is provided for an electronic device wherein a plurality of cavities are formed in the first mold half corresponding to molding locations on the electronic device. A plurality of plungers are located in the first mold half, each of which is drivable against a side of a respective cavity for applying a compacting force to encapsulation material located in the cavity during molding. A motor is operatively connected to the plungers for driving the plungers relative to the cavities.</p> |
申请公布号 |
SG148101(A1) |
申请公布日期 |
2008.12.31 |
申请号 |
SG20080033391 |
申请日期 |
2008.04.30 |
申请人 |
ASM TECHNOLOGY SINGAPORE PTE LTD |
发明人 |
YUAN HAO JI;YAP ONG SEE;XIONG SU JIAN;HOCK KUAH TENG;LING CHIW EE |
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