Wire bonding apparatus

摘要

A wire bonding apparatus includes a heat block (121) and a heat plate (122) provided on the heat block (121). A recess (1221) is provided in the heat plate (122) to receive the first semiconductor chip (41) and wires (51) without contact therewith when the lead frame (50) is provided on the heat plate (122) such that the first main surface (501) of the lead frame (50) faces toward heat plate. A duct (13) is provided in the heat plate (122) to connect the recess (1221) to the outside of the heat plate (122). A gas supplied through the duct (13) is heated by a heater (14) and discharged into the recess (1221).