发明名称 |
Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment |
摘要 |
An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a plurality of walls coupled to the microchannel structure to define a manifold. The manifold is in communication with at least a plurality of the microchannels. The plurality of walls includes a side wall. The side wall has a port therein. The port allows the coolant to flow in a direction that is either into the manifold or out of the manifold.
|
申请公布号 |
US7471515(B2) |
申请公布日期 |
2008.12.30 |
申请号 |
US20070942158 |
申请日期 |
2007.11.19 |
申请人 |
INTEL CORPORATION |
发明人 |
CHANG JE-YOUNG;CHRYSLER GREGORY M. |
分类号 |
H05K7/20;F28F7/00 |
主分类号 |
H05K7/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|