| 摘要 |
<p>A packing tray for a semiconductor package and a manufacturing method thereof are provided to bond pockets adamantly and reduce deformation including a thermal process etc. as projections of a main body of a rigid material support the pockets of a flexible material. A packing tray for a semiconductor package comprises a main body(110), a mounting hole, a pocket(120) and space for an injection runner. The main body is a sheet form and a first material. The mounting hole is formed into a plurality in order to pass through the main body. The pocket is mounted in order to surround the inner side of the mounting holes. The pocket provides the space accommodating the semiconductor package. The space for the injection runner is formed between a pair of mounting holes. The space for the injection runner guides the second material to the mounting holes.</p> |
