发明名称 APPARATUS FOR JOINING AUTOMATICALLY
摘要 An automatic joining unit of an aluminum electrode plate and a copper electrode plate is provided to remove the bubble generated in joining process by automatically joining the aluminum electrode plate and the copper electrode plate. An automatic joining unit of an aluminum electrode plate and a copper electrode plate comprises a film(20) in which a plurality of copper electrode board fields is adhered; a second film(34) in which a plurality of aluminum electrode plates which the separation film is covered is adhered; a plurality of rollers(14, 18) is downwards mounted with upside; a support stand(12) in which the driving roller(16) rotating at the power of the motor between rollers is mounted; a plate(26) in which the end is broken while being positioned to the state falling down to the right side of the support stand with constant distance, the part(28) is formed; and a plurality of compressing rollers(38,40) positioned at the right side of the plate.
申请公布号 KR100875804(B1) 申请公布日期 2008.12.26
申请号 KR20070069405 申请日期 2007.07.11
申请人 KOREA INNOTEC CO., LTD. 发明人 HUH, YOUNG SIK
分类号 B23K20/04;B23K20/00;H01M4/139 主分类号 B23K20/04
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