| 摘要 |
<p>A stacked semiconductor package and a manufacturing method thereof are provided to solve an electrical contact defect between semiconductor chips. A stacked semiconductor package(100) comprises a semiconductor chip module(200), a conductivity growth layer(300) a base substrate(400) and a molding material(500). The semiconductor chip module comprises laminated semiconductor chips(210,220,230,240) in which via holes(215,225,235,245) which are mutually arranged are formed. The conductivity growth layer is arranged inside the arranged via holes. The conductivity growth layer is grown up according to the via holes. The base substrate supports the semiconductor chip module. The base substrate comprises a substrate body(410), a connection pad(420), and a voland(430) and a solder ball(440).</p> |
