CONDUCTIVE PASTE, PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

A conductive paste, a printed circuit board using the same and a manufacturing method thereof are provided to realize the simplification of a process, reduction of process time and reliability by reducing the printing counter for forming bump. A conductive paste comprises 80~90 parts by weight of conductive particles; and 10~20 parts by weight of a mixture of a polymer and a foaming polymer. The conductive particles comprise any one selected from a group consisting of silver, copper, tin, indium and nickel. The polymer comprises at least one selected from a group consisting of epoxy-based or phenol-melamine-base resin.