| 摘要 |
A DCB substrate module is provided to prevent packaging liquid from leaking in coating packaging liquid by implementing a closure structure. A DCB substrate module comprises a DCB(Direct Copper Bonded), and a pin block. DCB comprises an insulating layer(110), and copper layers(120a,120b). The copper layers are formed in both side surfaces of the insulating layer. The pin block comprises a plurality of pins(210), and a housing(220). The housing is formed so that the space of the interval between the pins and an insulating layer of DCB to be shut tightly. The pin is the shape of 'L'. A portion of the pins is contacted to the copper layer formed in the rear side of the DCB.
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