SHOWERHEAD FOR DEPOSITING THIN FILM ON WAFER AND METHOD FOR CLEANING APPARATUS FOR DEPOSITING THIN FILM ON WAFER

摘要

A shower head for an apparatus for depositing a thin film and a cleaning solution of an apparatus for depositing a thin film are provided to make temperature uniform in a whole shower head and make the flow rate of the gas supplied through the shower head uniform so that a thin film having excellent uniformity is deposited. A shower head(300) for an apparatus for depositing a thin film comprises a main body(310), a gas distribution plate(320), and a heat transfer member(340). The main body is arranged on the top of a reactor in which a substrate is mounted. In the main body, a gas supply inlet(250) in which the gas is supplied is molded. In order to form the diffusion space in which the gas supplied through the gas supply inlet is diffused with the main body, the gas distribution plate is installed in the main body to be separated downward to the upper side of the main body. In the gas distribution plate, a plurality of jet holes(360) which passes through between an upper side and lower side so that the gas is emitted to downward are formed. The heat transfer member is installed so that one end of both end parts is contacted with the main body or the gas distribution plate. The heat transfer member serves as a thermal conductive path between the gas distribution plate and main body.