ELECTRONIC DEVICE MANUFACTURING METHOD AND ELECTRONIC DEVICE

摘要

An electronic device and a manufacturing method thereof are provided to connect a bump to a conductive layer with a superior state by metallically connecting the bump to the conductive layer. A manufacturing method of an electronic device comprises: a first process of forming a bump(104) having a projection(104B) on an electrode pad(103) formed in a substrate(101A) main body; a second process of forming a insulating layer(105) on the substrate body and exposing a part of projection to the upper side of the insulating layer; a third process of forming a conductive layer(107A) by using a deposition method in the upper side of the insulating layer and a part which is exposed of a projection; a fourth process of forming a wiring layer by a electroplating in which conductive layer is used as an electric supply layer; and a fifth process of patterning the wiring layer and forming a conductive pattern connected to the bump.