LIGHT EMITTING DIDODE PACKAGE

摘要

The light-emitting diode package is provided to prevent the sloped light-emitting diode from being mounted on the printed circuit board. The light-emitting diode package comprises the lead frame(200), and the housing(100). The lead frame comprises electrode pads(212,222) and electrode leads(214,224). The electrode pad is exposed through the window(104) formed into the housing inside wall in the first direction. The electrode lead is exposed through the penetration hole(122) in the second direction. The housing comprises the stairs protrusion(120) in which the housing inside wall of the window edge is precipitated.