发明名称 Graphics card heat-dissipating device
摘要 A graphics card heat-dissipating device includes: a main body, a support seat, and a fixed element. The main body has a first heat-dissipating portion and a second heat-dissipating portion, and the first heat-dissipating portion has a first opening and the second heat-dissipating portion has a second opening. The support seat is used for supporting a chip, and the support seat has a third opening. The fixed element is fixed on the first heat-dissipating portion by passing through the second opening, the third opening and the first opening in sequence for attaching the chip on the first heat-dissipating portion. Therefore, the heat convection function and the heat-dissipating efficiency are increased.
申请公布号 US7468890(B2) 申请公布日期 2008.12.23
申请号 US20070808579 申请日期 2007.06.12
申请人 COOLER MASTER CO., LTD. 发明人 LIN WEI-PIN
分类号 H05K7/20;F28F7/00;H01L23/34 主分类号 H05K7/20
代理机构 代理人
主权项
地址