发明名称 Light-emitting diode heat-dissipating module
摘要 The present invention discloses a LED (Light-Emitting Diode) heat-dissipating module, which comprises a heat-dissipating fin, a heat-conduction pipe, a LED illumination module and a casing. The heat-dissipating fin has an insertion/press-fit member inserted by or press-fitted to the heat-conduction pipe. The heat-conduction pipe has a contact region contacting the LED illumination module. In the application of the present invention, the LED illumination module is installed on the contact regions of several heat-conduction pipes inserted into or press-fitted to the heat-dissipating fins; thus, the heat generated by the LED illumination module can be effectively dissipated. Then, the LED illumination module is placed inside the casing having an accommodation space. Thus, heat can be conducted via the heat-conduction pipe to the heat-dissipating fin and then fast dissipated therefrom even though the LED illumination module is placed inside the casing.
申请公布号 US7467882(B2) 申请公布日期 2008.12.23
申请号 US20070804186 申请日期 2007.05.17
申请人 CHANG KUN-JUNG;JUAN CHING-YUAN;LIN KUO-CHUN 发明人 CHANG KUN-JUNG;JUAN CHING-YUAN;LIN KUO-CHUN
分类号 B60Q1/06;F21V29/00 主分类号 B60Q1/06
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