发明名称 Strained silicon on a SiGe on SOI substrate
摘要 An intermediate semiconductor structure is disclosed. The semiconductor structure includes a substrate; a relaxed Si1-xGex layer on the substrate, the relaxed Si1-xGex layer having at least one trench; an un-etched Si layer portion on the substrate and beneath the relaxed Si1-xGex layer along a periphery of the substrate providing structural support for the relaxed Si1-xGex layer along the periphery of the substrate; and at least one void between the relaxed Si1-xGex layer and the substrate, wherein the void encompasses an entire surface area of the substrate but for a portion of the substrate in contact with the un-etched Si layer portion.
申请公布号 US7468538(B2) 申请公布日期 2008.12.23
申请号 US20050061444 申请日期 2005.02.22
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CHENG KANGGUO;CHIDAMBARRAO DURESETI
分类号 H01L27/01;H01L21/20;H01L21/336;H01L21/762;H01L29/10;H01L29/786 主分类号 H01L27/01
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