| 摘要 |
A semiconductor stacked package and a method of manufacture thereof are provided to reduce the thickness of a semiconductor chip as a mold is molded on the top of the semiconductor chip. A semiconductor stacked package(80a) comprises a laminated semiconductor chip(100), a mold(120), a conductive element(110) and an outer connector. The mold is molded in the surfaces of the semiconductor chips. The conductive element electrically interconnects the semiconductor chips. The outer connector is electrically connected to an outermost semiconductor chip among the semiconductor chips. The outer connector is a solder ball or a metal bump. |
