| 摘要 |
The invention provides a chemical-mechanical polishing composition comprising an abrasive, a benzotriazole derivative, an oxidizing agent selected from the group consisting of iodate compounds, organic oxidizing agents, and mixtures thereof, and water, wherein the polishing composition comprises substantially no organic carboxylic acid having a molecular weight of less than 500 Daltons, and wherein the polishing composition comprises no alkyl sulfate having a molecular weight of less than 500 Daltons. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition. ® KIPO & WIPO 2009
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