摘要 |
The spin assembly system of the SOG equipment is provided to improve production yield by exhausting the coating solution which is collected in the spin cup from the upper side and lateral side to the exhausting hole. The spin assembly system(40) of the SOG equipment comprises the spray port(42), the spin chuck(50), and the spin cup(37). The spray port is positioned at the upper of wafer and sprays the coating solution on the wafer surface. The spin chuck vacuum-absorbs the wafer and rotates. The spin cup is positioned around the lateral side of the spin chuck and wafer. The spin cup collects the residual coating solution in the process and discharges it to the vent(49). The coating solution spray hole and the first cleaning solution spray hole(45a) are formed in the bottom surface of the inner side spray port. The second cleaning solution spray hole(45b) is formed in the bottom surface of the outer side spray port. The spray hole which jets the cleaning solution is formed in the inside wall of the spin cup. The nitrogen gas spray hole is formed in the spin chuck.
|