CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND CAMERA MODULE

摘要

The ceramic substrate, the manufacturing method thereof and camera module are provided to improve the reliability and productivity by preventing the short and connection failure when connecting the conductive member like the anisotropic conductive film to the flexible printed circuit board by a flip chip method. The ceramic substrate(100) comprises the middle ceramic layer(120), and the bottom ceramic layer(110). The middle ceramic layer has the middle part connection groove(121) for side mode connection and the terminal of the external device. The middle ceramic layer has the side pad(122) developed in the middle connection groove. The bottom ceramic layer is laminated on the lower part of the middle ceramic layer. The bottom ceramic layer has the bottom connection groove(111) whose size is smaller than the width of the middle connection groove. The bottom ceramic layer hash the lower-part pad(113) on the linear type.