发明名称 POLY/(PHENYLENE ETHER) RESIN COMPOSITION, PREPREG, AND LAMINATED SHEET
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a poly(phenylene ether) resin composition obtaining a laminated sheet excellent in heat resistance and processability even when using a low molecular weight PPE in order to enhance convenience in a prepreg manufacturing without degrading dielectric characteristics. <P>SOLUTION: This poly(phenylene ether) resin composition contains poly(phenylene ether) and a crosslinking curing agent, wherein the poly(phenylene ether) includes the poly(phenylene ether) represented by the following formula (I) and the number averaged molecular weight thereof is in the range of 1,000 to 7,000 and the poly(phenylene ether) represented by the following formula (I) and the number averaged molecular weight thereof is in the range of 9,000 to 18,000. [Wherein, X is an aryl group; (Y)<SB>m</SB>is a poly(phenylene ether) moiety; Z is a phenylene group, an oxygen atom or a sulfur atom; R<SP>1</SP>to R<SP>3</SP>are each independently a hydrogen atom, an alkyl group, an alkenyl group or an alkynyl group; n is an integer of 1 to 6; and q is an integer of 1 to 4]. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2008303382(A) 申请公布日期 2008.12.18
申请号 JP20080117238 申请日期 2008.04.28
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 INOUE HIROHARU;SAITO EIICHIRO;FUJIWARA HIROAKI
分类号 C08F290/06;B32B15/08;B32B15/14;B32B27/04;C08F283/08;C08G65/48;C08J5/24;C08L71/12;H05K1/03 主分类号 C08F290/06
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