| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module that can be miniaturized even if it has a passive component and a method for manufacturing the same. SOLUTION: The semiconductor module 1 has a first interposer 2, an active surface 3A and a backside 3B, and is provided with a semiconductor chip 3 disposed with the backside 3B opposed to the first interposer 2, a second interposer 40 that is opposed to the active surface 3A of the semiconductor chip 3 and is electrically connected to the semiconductor chip 3, and is electrically connected to the first interposer, and a passive part 4 mounted on at least an upper surface 40A of the second interposer 40. COPYRIGHT: (C)2009,JPO&INPIT |
