| 摘要 |
PROBLEM TO BE SOLVED: To provide photoresist coating technique for reducing the consumption of photoresist by dripping the photoresist through high-speed rotation and obtaining high in-surface film thickness precision in filming of a substrate (wafer) with the photoresist. SOLUTION: Disclosed is a coating device which films the wafer with the photoresist to a prescribed thickness by dripping the photoresist on the wafer and rotating the wafer. Further, disclosed is a coating method in which a wafer rotational frequency is so controlled that when the wafer is rotated and coated with the photoresist, the rotational frequency of the wafer is decreased after the photoresist is dripped and spread over the entire surface of the wafer while the wafer is rotated at a rotational frequency RH higher than a filming rotational frequency RL of the photoresist and then the filming with the photoresist is carried out at the filming rotational frequency RL, lower than a turbulence generation rotational frequency RR, at which the prescribed film thickness is obtained. COPYRIGHT: (C)2009,JPO&INPIT
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