发明名称 METHOD OF FORMING SOLID BLIND VIAS THROUGH THE DIELECTRIC COATING ON HIGH DENSITY INTERCONNECT (HDI) SUBSTRATE MATERIALS
摘要 A method is provided cmoprising: coating an electrically conductive core with a first removable material, creating openings in the first removable material to expose portions of the electrically conductive core, plating a conductive material onto the exposed portions of hte electrically conductive core, coating the conductive material with a second removable material, removing the first removable material, electrophoretically coating the electrically conductive core with a dielectric coating, and removing the second removable material.
申请公布号 WO2008154123(A2) 申请公布日期 2008.12.18
申请号 WO2008US64070 申请日期 2008.05.19
申请人 PPG INDUSTRIES OHIO, INC. 发明人 OLSON, KEVIN C.;WANG, ALAN E.
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
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