MULTILAYER BOARD SURFACE-TREATED CONFIGURATION AND THE PRODUCING METHOD THEREOF

摘要

A configuration of the surface-treated multilayer board comprises a pad, at least a cover metal layer and a solder mask. The pad has been set in the dielectric layer. The cover metal layer is applied for covering the pad, and the solder mask has an opening for exposing the cover metal layer. The producing method thereof is performed by firstly forming the cover metal layer onto the surface of the pad, and secondly forming the solder mask, then thirdly opening the solder mask at the portion of the cover metal layer for exposing the cover metal layer. As the pad of being set in the dielectric layer, the adhesion between the pad and the dielectric layer increases. At the same time because the solder mask covers part of the cover metal layer, it can be avoided of the contact between the tin material or the other solder and the pad while encapsulation.