发明名称 RESIST COMPOSITION FOR NEGATIVE WORKING-TYPE DEVELOPMENT, AND METHOD FOR PATTERN FORMATION USING THE RESIST COMPOSITION
摘要 <p>This invention provides a resist composition for negative working-type development, which can reduce line edge roughness, can enhance the in-plane evenness of the pattern dimension, and further is excellent in bridge margin, for stably forming a highly accurate fine pattern for the production of a highly integrated and highly accurate electronic device, and a method for pattern formation using the resist composition. The resist composition for negative working-type development comprises (A) a resin which undergoes, upon exposure to the action of an acid, an increase in its polarity, an increase in its solubility in a positive working-type developing solution, and a decrease in its solubility in a negative working-type developing solution, (B) a compound which generate an acid upon exposure to an actinic radiation or a radiation, and (C) a solvent. The logP value of the acid generated from the compound (B), which generates an acid upon exposure to an actinic radiation or a radiation, is not less than 1.5 and not more than 12.0.</p>
申请公布号 WO2008153110(A1) 申请公布日期 2008.12.18
申请号 WO2008JP60800 申请日期 2008.06.12
申请人 FUJIFILM CORPORATION;TSUBAKI, HIDEAKI 发明人 TSUBAKI, HIDEAKI
分类号 G03F7/004;G03F7/038;G03F7/30;H01L21/027 主分类号 G03F7/004
代理机构 代理人
主权项
地址