| 发明名称 |
SUBSTRATE DETECTING APPARATUS, SUBSTRATE ALIGNING APPARATUS, SUBSTRATE BONDING APPARATUS HAVING SUBSTRATE DETECTING APPARATUS AND SUBSTRATE ALIGNING APPARATUS, WAFER OUTER SHAPE DETECTING APPARATUS, WAFER ALIGNING APPARATUS, AND WAFER BONDING APPARAT |
| 摘要 |
<p>A wafer outer shape detecting apparatus (10) is provided with a rotating apparatus (12) for rotating a wafer (11); an edge detecting apparatus (15) for detecting the edge of the wafer placed on the rotating apparatus; a servo apparatus (16) for making the edge detecting apparatus follow displacement of the wafer edge; and a position detecting apparatus (17) for detecting the position of the edge detecting apparatus to the radius direction of the wafer.</p> |
| 申请公布号 |
WO2008153086(A1) |
申请公布日期 |
2008.12.18 |
| 申请号 |
WO2008JP60724 |
申请日期 |
2008.06.05 |
| 申请人 |
NIKON CORPORATION;TANAKA, TOSHIHISA;OONE, KAZUYASU |
发明人 |
TANAKA, TOSHIHISA;OONE, KAZUYASU |
| 分类号 |
H01L21/02;H01L21/68 |
主分类号 |
H01L21/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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