发明名称 ROOM TEMPERATURE CURING ADHESIVE COMPOSITION HAVING HIGH TEMPERATURE PROPERTIES
摘要 Room temperature curing structural adhesive compositions including polyur ethane oligomers having multi-methacrylate functionality, cycloalkylmethacry late, at least one maleimide-functionalized compound and a cure system are d isclosed. These compositions exhibit enhanced high temperature properties, i ncluding hot strength, heat/humidity strength, and heat aging strength, with out compromising initial tensile strength and fixture speeds and still posse ssing a room temperature cure.
申请公布号 CA2689595(A1) 申请公布日期 2008.12.18
申请号 CA20082689595 申请日期 2008.06.04
申请人 HENKEL CORPORATION 发明人 LEVANDOSKI, SUSAN LAMTROUNG;CZABAJ, BRIAN M.;VEROSKY, CHRISTOPHER J.
分类号 C09J201/10;C09J121/00;C09J201/02 主分类号 C09J201/10
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