| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component built-in module which has superior heat radiation characteristics and can simplify manufacturing steps and decrease members. <P>SOLUTION: A second component built-in substrate 150b having electronic components 104c to 104e built in is stacked on a first component built-in substrate 150a having electronic components 104a to 104b built in, and a heat sink 107 is fitted onto the second component built-in substrate 150b. The second component built-in substrate 150b includes a wiring layer 102b having electronic components mounted on one main surface and an insulating layer 109 which consists principally of a mixer containing an inorganic filler and a thermosetting resin and in which the electronic components 104c to 104e mounted on the wiring layer 102b are buried. The insulating layer 109 of the second component built-in substrate 150b conducts heat from the electronic components 104c to 104e and wiring layer 102b to the heat sink 107. <P>COPYRIGHT: (C)2009,JPO&INPIT |
