| 摘要 |
<P>PROBLEM TO BE SOLVED: To accurately image a semiconductor chip with a large step in the height direction and shorten a time for imaging a lead frame in an imaging device for bonding apparatus. <P>SOLUTION: The imaging device for bonding apparatus is provided with a high-magnification optical system having first and second high-magnification optical paths S1, S2 that reach a plurality of imaging surfaces 36 and 37 through a high-magnification lens 34 and have different lengths of the optical paths between the high-magnification lens 34 and the imaging surfaces 36 and 37 so as to support a plurality of imaging ranges for objects located at different positions from the high-magnification lens 34; and a low-magnifcation optical system that is provided with a low-magnification optical path 53 reaching an imaging surface 38 through a low-magnification lens 35 and has a wider field of view than the high-magnification optical paths 51 and 52. Each of imaging elements 31 and 32 provided with the imaging surfaces 36 and 37 of the high-magnification optical system acquires an image of a semiconductor chip 63, and an imaging element 33 provided with an imaging surface 38 of a low-magnification optical system acquires an image of a lead frame 61. <P>COPYRIGHT: (C)2009,JPO&INPIT |
