CAMERA MODULE PACKAGE AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a camera module package having flexibility, and to provide its manufacturing method.

SOLUTION: The camera module package 100 comprises a wafer 110 provided with an image sensor 140 and pads 150; a lens part 120 placed over the upper part of the wafer 110 and having a convex lens 121, in a mounting portion of the image sensor 140; and a flexible board 130 connected closely to the lower face of the wafer 110 and electrically connected to the pads 150 by an internal pattern.

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