| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device equipped with a packaged radiator, which has a structure capable of reducing deformations such as warping, distortion or the like without thickening a whole package, while dissipating heat by the radiator. SOLUTION: A semiconductor device 20 is provided with: plural bonding wires 23 which connect a wiring substrate 21, a semiconductor device 22 distributed and arranged on the wiring substrate 21, an electrode on the wiring substrate 21, and an electrode pad of the semiconductor device 22; resin 25 which seals a part of the semiconductor device 22 and the plural bonding wires 23 on the wiring substrate 21; and a radiator 26 distributed and arranged on the resin 25, characterized in that the radiator 26 is constituted so that a thickness of a site facing a distributed and arranged portion of the bonding wire 23 may be formed more thinly than those of other sites. COPYRIGHT: (C)2009,JPO&INPIT
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