| 摘要 |
PROBLEM TO BE SOLVED: To provide a multicathode structure of a sputtering system capable of forming a thin film in which the distributions of film thickness and specific resistance in a substrate causing a problem by the enlargement of a target size accompanying the enlargement of a substrate size are satisfactory. SOLUTION: In the multicathode structure of the sputtering system, a backing 12 provided with a target 9 includes a plurality of partition plates 14 fitted via an insulation plate 19. By directly fixing the outer circumferential part of each partition plate 14 to a frame 18, a thin film in which the distributions of film thickness and specific resistance in a substrate are satisfactory can be formed. COPYRIGHT: (C)2009,JPO&INPIT
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