发明名称 |
LOW-PROFILE HEAT-SPREADING LIQUID CHAMBER USING BOILING |
摘要 |
Systems and fabrication methods are disclosed for a heat spreader to cool a device. The heat spreader has first and second opposing proximal surfaces defining a chamber having a liquid therein; and one or more structures mounted in the chamber to induce a liquid flow pattern during a boiling of the liquid to distribute heat. |
申请公布号 |
WO2008118667(A3) |
申请公布日期 |
2008.12.18 |
申请号 |
WO2008US57135 |
申请日期 |
2008.03.14 |
申请人 |
VAPRO, INC. |
发明人 |
YOU, SEUNG MUN;KIM, JOO HAN;KWARK, SANG M.;KIM, JESSE JAEJIN |
分类号 |
F28D15/04 |
主分类号 |
F28D15/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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