Wafer surface area detecting device, has line scan camera with detector row whose length is smaller than diameter of wafer, and color scan camera with two-dimensional detector chip upstream to dispersive element

摘要

The device (1) has a table (6), on which a wafer (4) is placed. The table is movable in an X-coordinate and Y-coordinate directions, and an illumination source is arranged opposite to the wafer. A generation device generates a relative movement between cameras and the wafer. One of the cameras is a line scan camera with a detector row (16), and is formed as a time delayed integration camera, where length of the detector row is smaller than diameter of the wafer. The other camera is a color scan camera and has a two-dimensional detector chip upstream to a dispersive element. An independent claim is also included for a method for detecting total surface area of a wafer.