FLEXIBLE ELECTRONICS PACKAGE AND METHOD FOR MANUFACTURING SUCH A PACKAGE

摘要

A flexible electronics package (1;40;50) comprising a flexible substrate (10), having an electronic component (3) connected thereto, and a flexible encapsulant (12) at least party embedding the flexible substrate(10). The flexible electronics package (1;40;50) further comprises at least a first textile sheet (13) provided on a first side (11) of the flexible substrate (10), the first textile sheet (13) being at least partly embedded by the flexible encapsulant (12).