| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that prevents a conductive pattern from being cracked. SOLUTION: The semiconductor device of this invention includes a first straight line conductive pattern 12 mounted on an insulating film 10, a second straight line conductive pattern 14 which is disposed on the insulating film 10 and bonded to an end portion of the first conductive pattern 12 in a direction of 90°to the first conductive pattern 12, a right triangle auxiliary pattern 16 which is disposed on the insulating film 10 positioned at an inner angle side of the bonded portion of the first conductive pattern 12 and second conductive pattern 14 and connected to each of the first conductive pattern 12 and second conductive pattern 14, and a passivation film 20. Two sides between right angle portions of the auxiliary pattern 16 are in line contact with each of the first conductive pattern 12 and second conductive pattern 14. COPYRIGHT: (C)2009,JPO&INPIT
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